Mobile Chipset Report – LTE, 5G and 3GPP IoT

Mobile Chipsets report.

Since our last report in August there has been further activity in the 5G chipset arena. We have previously identified Qualcomm’s Snapdragon X50, Intel’s XMM 8060, Samsung’s Exynos 5100 and Hi-Silicon’s Balong 5G01 modems (though the commercial status of the Intel XMM 8060 is unclear). We also previously identified MediaTek’s Helio M70 processor/platform as a (pre-commercial) 5G chipset. These are being joined by Intel’s XMM 8160 modem (announced) and Hi-Silicon’s Kirin 990 processor/platform (expected to be announced shortly) as well as a Qualcomm processor/platform expected to be announced before the end of 2018. Qualcomm has already released details of its mmWave antenna module (QTM052, designed to complement the X50 modem chipset) and a sub-6 GHz RF front-end module (QPM56xx) developed specifically for 5G NR.

• 3 commercial 5G modem chipsets; more to follow soon, along with processor/
  platforms
• 23 discrete cellular modem chipsets supporting LTE (excluding 5G-capable silicon)
• 129 mobile platforms or processors supporting LTE
• 26 modem or platform chipsets supporting 3GPP IoT technologies

©2018 GSA

Content can be used providing GSA is reference as the source.